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Lead Engineer 1 - Electronic Hardware

  • Job Function: Engineering/Technology
  • Experience Level: Experienced
  • Posted Date: 3/21/2018 7:50:57 AM
  • Job #: 3043454
  • Location(s): India; Pune, Mumbai

About Us:
GE is the world's Digital Industrial Company, transforming industry with software-defined machines and solutions that are connected, responsive and predictive. Through our people, leadership development, services, technology and scale, GE delivers better outcomes for global customers by speaking the language of industry.

GE is an equal opportunity employer and supports Diversity.

To know more about BHGE Drill Bits team, go through the Links below:

Role Summary:
To accelerate new product development and enhance and support the existing downhole measurement tools in the drill bit productline.

Essential Responsibilities:
Lead the design and development of hardware components for drill bits.
Work with engineers in Woodlands Texas to understand needs and translate them to engineering specifications
Conceptualize modular architectures for given specifications
Support prototype building, testing and qualificaiton
Perform detailed design and six sigma reliability activities - DFMEA, Root cause analysis, Fishbone etc.
Support and debug field issues.

  • Altium Designer experience for Schematics and Layout
  • Low power design methods 
  • Lithium battery knowledge 
  • General Laboratory Equipment: ie. oscilloscope, power supplies, frequency generators
  • Excellent verbal and communication skills 
  • Analog Design
  • Required
    Working knowledge and experience in
    • Spice Simulation experience
    • Single ended and differential filter design (Sallen-Key and Multi-feedback) primarily for anti-aliasing 
    • Single and differential ADC experience (Sigma-Delta with modulation)
    • Strain gauge half and full bridge 
    • Linear regulators 
    • PCB layout techniques (some listed below but not all required) 
      • Layer stack up selection 
      • Via spokes for ease of soldering 
      • Ground plane connection 
      • Capacitor placement including decoupling
      • Parasitics vs frequency 
      • Differential pairs Via sizes 
      • Design Rule Check 
      • Gerber file creation 
      • Design For Manufacturability 
      • Material types, (FR4 vs Polyimide) 
      • High Temperature Design Techniques
        1. Thermal pads and heat transfer
        2. Thermal resistance

Desired Characteristics:
  • Additional sensor experience: ie. Accelerometers, Gyroscopes, Magnetometers 
  • Power supply design – Primarily flyback and buck topology 
  • Low noise amplifier
  • Grounding and shielding 
  • Matching Network 
  • Network and/or Impedance analyzer experience 
  • Control theory with PID 
  • Stability theory
  • Brushless DC Motor Driver design (full bridge)
  • SiC and GaN Fet knowledge 
  • Digital Design
    a. Required
    i. Processor board design essentials
    1. Oscillator/Crystal
    2. Reset IC
    3. Decoupling techniques
    4. Communication methods: Spi, I2C, RS232, Parallel bus
    5. LVDS and MLVDS TX/RX drivers
    ii. Push pull vs open collector/drain driver knowledge
    b. Good to have
    i. TI MSP430 and 28335 Delfino experience
    ii. Flash types good for HT
    iii. Communication methods: McBSP, RS485, IO1039, CAN
    iv. WiFi, and Bluetooth wireless standards
    v. FPGA Design and VHDL Coding experience
    vi. Logic analyzer experience
    vii. Switching mode power supply class D modulation 
  • Qualification Testing 
    • a. Highly Accelerated Life Testing with Margin
      b. Test Plan Creation and implementation
      c. Power de-rating
      d. LabView experience and/or training

Locations: India; Pune, Mumbai

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